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Signals SPa and SPb are assumed to arrive at the destination for (a) with equal strength The importance of this assumption and the manner in which it is realized in CDMA systems are discussed in the next section 3 Chipping codes are assumed to be synchronized at the sources and the destinations The reader is invited to explore the case where Ca is applied out of sync by even one chip between source and destination 4 For simplicity, the example uses chipping codes with a period that is 1/4 the bit period of the source, thus spreading the source s (baseband) signal by a factor of four 5 The codes used have properties that prevent them from interfering with each other The general requirements for chipping codes are discussed below..

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one can bias the detectors with a voltage by a factor of 3 5 higher than the full depletion voltage (Andricek et al, 2000) The GaAs and CdTe detectors for X-rays are usually made using semiinsulating materials with resistivity of the order of 1 105 to 1 106 cm Such detectors behave more like solid-state ionization chambers and one can assume that the electric eld is constant in the total sensitive volume In the strip detector structures the electric eld distribution around the strips may be highly non-uniform This non-uniformity affects the trajectories and velocities of charge carriers in the regions around the readout strips However, these regions are only a small fraction of the total sensitive volume of the detector These details are important for construction of the strip detectors, however, they do not affect signi cantly the range of diffusion spread.

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In addition, we assume that the electric eld is lower than the value at which the drift velocity saturates For most detectors it is possible to ful l both conditions, ie to bias the detector with voltage signi cantly higher than the full depletion voltage and to keep the electric eld below the velocity saturation point In numerical calculation both effects can be easily taken into account but for analytical evaluation the above approximations simplify the analysis Let us assume that photons enter the detector perpendicularly to its surface from the side of the collecting electrode.

The spread of charge carriers due to diffusion taking place during transport of the carriers to the readout electrode is characterized here by the full width at half maximum (FWHM) of the charge carrier distribution arriving at the collecting electrode when started from a point at the depth corresponding to the absorption length for X-rays of given energy The FWHM of the charge carrier distribution in the plane parallel to the electrode is then given as: FWMH = 4 ln 2tn,p Dn,p (452).

Moments of the Doppler spectra can be computed in complete analogy to the moments of the PDP. The integrated power is PB,m =

analysis for large-diameter wafers. High throughput and ease of operation are also indispensable in the highly competitive semiconductor industry. X-Ray analyses such as the methods of totalre ection X-ray uorescence (TXRF) spectrometry and X-ray re ectivity (XRR) meet these requirements, and signi cant improvements to these techniques have been seen in recent years. In this subchapter, progress in the industrial TXRF technique will rst be shown. The use of TXRF for semiconductor analysis started at the end of the 1980s, and came into popular use in the 1990s. Today, more than 300 TXRF spectrometers are installed in this industry worldwide, meaning that almost all leading-edge semiconductor factories have introduced TXRF. Since the main purpose of TXRF is trace contamination analysis, improvements in detection ability as well as reliability will be discussed. In addition, XRF and XRR/XRF analysers for the characterization of thin lms made from new materials will be introduced.

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